KOSTEC presents its high-thermal metal-ceramic packaging platform, developed to meet the increasing thermal management demands of next-generation electronic and optical devices. With the advancement of high-speed applications such as 1.6T optical transceivers, thermal performance has become a key challenge. Conventional materials with thermal conductivity around 220 W/m·K are no longer sufficient, as rising temperatures can significantly impact device reliability and lifetime. KOSTEC’s platform incorporates a high thermal conductivity substrate (up to 320 W/m·K) combined with a precision metal housing. This structure enables: -. Efficient heat dissipation -. Strong mechanical stability -. Reliable EMI shielding In addition, the solution can achieve up to a 20°C reduction in junction temperature, contributing to improved performance and long-term reliability. This platform is suitable for various applications, including: -. Optical transceivers and modulators -. Pump lasers -. RF power amplifiers -. Military electronics -. Co-packaged optics (CPO) substrates KOSTEC remains committed to providing advanced packaging solutions that support the evolving needs of high-performance semiconductor and photonics industries.

KOSTEC is proud to introduce its latest innovations in thermal and electrical performance optimization: Embedded T-Coin / I-Coin and Stepped Copper Coin technologies—designed to meet the increasing demands of next-generation AI, EV, and high-power electronic applications.As power density continues to rise, conventional PCB and packaging solutions face critical challenges such as thermal via saturation, localized hotspots, CTE mismatch, and high contact resistance. KOSTEC’s embedded coin solutions address these issues by creating a direct vertical thermal path within the PCB stack-up, significantly improving heat dissipation and long-term reliability.Embedded T-Coin / I-Coin SolutionThe Embedded Coin technology enables:-. Efficient thermal management through direct heat conduction paths-. Reduced thermo-mechanical stress caused by CTE mismatch-. Lower contact resistance at high-current interfaces-. Enhanced reliability under high-power operating conditions With customizable thickness and geometry, high-precision manufacturing (±10 μm tolerance), and compatibility with full copper or hybrid structures (KCMC), the solution supports cost-effective mass production without requiring initial tooling investment.Stepped Copper Coin for Chip Embedding KOSTEC’s Stepped Copper Coin technology provides an advanced platform for thermal and power delivery optimization, particularly in:-. EV traction inverters-. AI server power modules-. High-density DC-DC converters-. SiC / GaN-based power systems Key advantages include:-. 3D Z-axis heat path for rapid hotspot removal-. Stable and low contact resistance via Au-plated surfaces-. Tunable thickness for optimized board stack design-. Scalable supply for high-volume production Additionally, hybrid die-attach zone options (Full Copper, KCMC Hybrid, AMB Hybrid) allow customers to balance thermal performance, stress reduction, and reliability depending on application requirements.Scalable Platform for Future ElectronicsKOSTEC integrates advanced manufacturing technologies—including diffusion bonding, multi-wire cutting, brazing, plating, and tape-and-reel packaging—to deliver a highly scalable and cost-efficient production platform.These innovations enable customers to achieve up to 60% performance improvement compared to conventional packaging solutions, making them ideal for high-performance and reliability-critical applications.For more information about KOSTEC’s Embedded Coin and Stepped Copper Coin solutions, please contact us

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KOSTEC presents its high-thermal metal-ceramic packaging platform, developed to meet the increasing thermal management demands of next-generation electronic and optical devices. With the advancement of high-speed applications such as 1.6T optical transceivers, thermal performance has become a key challenge. Conventional materials with thermal conductivity around 220 W/m·K are no longer sufficient, as rising temperatures can significantly impact device reliability and lifetime. KOSTEC’s platform incorporates a high thermal conductivity substrate (up to 320 W/m·K) combined with a precision metal housing. This structure enables: -. Efficient heat dissipation -. Strong mechanical stability -. Reliable EMI shielding In addition, the solution can achieve up to a 20°C reduction in junction temperature, contributing to improved performance and long-term reliability. This platform is suitable for various applications, including: -. Optical transceivers and modulators -. Pump lasers -. RF power amplifiers -. Military electronics -. Co-packaged optics (CPO) substrates KOSTEC remains committed to providing advanced packaging solutions that support the evolving needs of high-performance semiconductor and photonics industries.

KOSTEC is proud to introduce its latest innovations in thermal and electrical performance optimization: Embedded T-Coin / I-Coin and Stepped Copper Coin technologies—designed to meet the increasing demands of next-generation AI, EV, and high-power electronic applications.As power density continues to rise, conventional PCB and packaging solutions face critical challenges such as thermal via saturation, localized hotspots, CTE mismatch, and high contact resistance. KOSTEC’s embedded coin solutions address these issues by creating a direct vertical thermal path within the PCB stack-up, significantly improving heat dissipation and long-term reliability.Embedded T-Coin / I-Coin SolutionThe Embedded Coin technology enables:-. Efficient thermal management through direct heat conduction paths-. Reduced thermo-mechanical stress caused by CTE mismatch-. Lower contact resistance at high-current interfaces-. Enhanced reliability under high-power operating conditions With customizable thickness and geometry, high-precision manufacturing (±10 μm tolerance), and compatibility with full copper or hybrid structures (KCMC), the solution supports cost-effective mass production without requiring initial tooling investment.Stepped Copper Coin for Chip Embedding KOSTEC’s Stepped Copper Coin technology provides an advanced platform for thermal and power delivery optimization, particularly in:-. EV traction inverters-. AI server power modules-. High-density DC-DC converters-. SiC / GaN-based power systems Key advantages include:-. 3D Z-axis heat path for rapid hotspot removal-. Stable and low contact resistance via Au-plated surfaces-. Tunable thickness for optimized board stack design-. Scalable supply for high-volume production Additionally, hybrid die-attach zone options (Full Copper, KCMC Hybrid, AMB Hybrid) allow customers to balance thermal performance, stress reduction, and reliability depending on application requirements.Scalable Platform for Future ElectronicsKOSTEC integrates advanced manufacturing technologies—including diffusion bonding, multi-wire cutting, brazing, plating, and tape-and-reel packaging—to deliver a highly scalable and cost-efficient production platform.These innovations enable customers to achieve up to 60% performance improvement compared to conventional packaging solutions, making them ideal for high-performance and reliability-critical applications.For more information about KOSTEC’s Embedded Coin and Stepped Copper Coin solutions, please contact us