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Thermal Matched Lead Frame
SiC power semiconductor
GaN RF power semiconductors
- - Heat Slug와 Lead Frame은 각각 별도 또는 리벳 기술로 조립된 상태로 공급 가능합니다.
- - Heat Slug는 Copper 또는 KCMC®소재를 권장합니다.
| No. | Item | Materials | 열팽창 계수 [ppm/˚C] | 열전도율[W/(m.K)]25℃ (Z-direction) |
Process | |
|---|---|---|---|---|---|---|
| 150˚C | 300˚C | |||||
| 1 | Lead Frame | Copper | 17 | 380 | None, Ag, PdAu, etc. | |
| 2 | Heat Slug | KCMC®12 | 11.05 | 9.01 | 320 | Ag, PdAu etc. |
| KCMC®33 | 7.83 | 6.96 | 241 | |||
| Copper | 17 | 380 | ||||
Applications
- GaN, LDMOS, SiC devices
- Aerospace and Defense
- Industrial, scientific and medical
- Automotive
- 5G Wireless Infrastructure
- Commercial and consumer cooking
- Various devices for automotive and Semiconductors
