the first in Korea to develop and mass-produce low thermal expansion, high heat dissipation materials. KOSTECSYS specializes in manufacturing high heat dissipation components such as RF packages, spacers, and thermal matched lead frames for SiC and GaN next-generation power semiconductors. Through continuous innovation, high reliability, exceptional quality, and rapid response to customer needs, KOSTECSYS has grown into a leading supplier of high heat dissipation components in the global market.

KOSTECSYS's proprietary low thermal expansion, high heat dissipation materials, KCMC® plays a critical role in next-generation semiconductor properties such as heat dissipation, performance, reliability, durability, fire and explosion protection, which are critical to SiC and GaN next-generation semiconductors.

Valuing relentless quality management, top-tier customer satisfaction, and responsibility for people, the environment, and society, KOSTECSYS is set to become a global leader in the field of high-heat dissipation materials for next-generation semiconductors.
We ask for your warm interest and support for KOSTECSYS, a company driven by a passion for challenge and innovation.