KOSTECSYS - Low thermal expansion & High heat dissipation & Low parasitic impedance materials.

- Heat Slug and Lead Frame can be supplied separately or assembled using rivet technology.
- Heat Slug recommends Copper or KCMC® materials.

No.	Item	Materials	Thermal Expansion [ppm/˚C]		Thermal Conductivity[W/(m.K)]25℃ (Z-direction)	Process
No.	Item	Materials	150˚C	300˚C	Thermal Conductivity[W/(m.K)]25℃ (Z-direction)	Process
1	Lead Frame	Copper	17		380	None, Ag, PdAu, etc.
2	Heat Slug	KCMC®12	11.05	9.01	320	Ag, PdAu etc.
		KCMC®33	7.83	6.96	241
		Copper	17		380