KOSTECSYS Diffusion Bonding Machine (Spark Plasma Sintering) provides an optimized solution for sintering multi-layered heterogeneous materials.

The Diffusion Bonding process offers significant advantages compared to traditional Hot Press processes, such as faster sintering, lower temperature/pressure, and shorter processing time.

By simultaneously applying temperature and pressure while directly heating the product, the process enables rapid sintering, achieving high-density bonding materials and excellent mechanical properties with superior interfacial bonding characteristics.