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KCMC
®
High Heat Dissipation Materials
Copper Pin, Copper Pillar
Thermal Matched Lead Frame
Air Cavity Packages
KCMC
®
Base Plate, Copper Base Plate
(Pin Fin / Flat type)
Photonic Integrated Circuit Packages
Liquid Cold Plate, Cooling Block
LD Packages for Laser Modules
Current Sensor Shunt Resistors
Key Technologies
Diffusion Bonding
Automated Robot Plating
Automatic Stamping
Precision Micro Machining
Hermetic Brazing
Metallized Ceramics
Next-Generation Thermal Simulations
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