Company
Company Overview
Management
Catalog
History
Location
Products
KCMC
®
High Heat Dissipation Materials
Copper Pin, Copper Pillar
Thermal Matched Lead Frame
Air Cavity Packages
KCMC
®
Base Plate, Copper Base Plate
(Pin Fin / Flat type)
Photonic Integrated Circuit Packages
Liquid Cold Plate, Cooling Block
LD Packages for Laser Modules
Current Sensor Shunt Resistors
Key Technologies
Diffusion Bonding
Automated Robot Plating
Automatic Stamping
Precision Micro Machining
Hermetic Brazing
Metallized Ceramics
Next-Generation Thermal Simulations
Ir
Disclosure
Information
IR News
IR Library
News
News
Notice
Recruit
Inquiry
Esg
ESG
Green Management
Ethical Management
Report
Quality Management
Certificate, RoHS
ENG
KOR
ENG
SEARCH
search
home
Notice
All
Title
Content
search
ENG 
KOR