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Air Cavity Plastic Packages

Overview

  • - Plastic near hermetic air cavity packages and B-stage components deliver the highest performance and reliability in the industry.
No. Item Materials Thermal Expansion [ppm/˚C] Thermal Conductivity[W/(m.K)]25℃
(Z-direction)
Process Plating
150˚C 300˚C
1 Flanges,
Carriers
KCMC®12 11.05 9.01 320 Stamping, Wire Cutting, etc. Ni, NiCo, Ag, PdAu, Au, etc.
KCMC®20 9.12 7.69 291
KCMC®28 8.83 7.57 263
KCMC®33 7.83 6.96 241
KCMC®40 7.34 6.59 222
Copper, CuMo, CPC, etc. - - -

Applications

  • GaN, LDMOS, SiC Device
  • Aerospace and Defense
  • Industrial, scientific and medical
  • Automotive
  • 5G Wireless Infrastructure
  • Commercial and consumer cooking
  • Various devices for automotive and Semiconductors
If you have any inquiries about KOSTECSYS
we will respond as quickly as possible.
  • +82-32-821-0162
  • +82-32-822-4923