Air Cavity QFN Packages
Overview

- Maximum heat resistance +260°C
- mmWave, High frequency
- Impedance 50Ω matching
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Material
- - Flange : Cu
- - Insulator : LCP (Liquid Crystal Polymer)
Insertion loss, Return loss
- KOSRECSYS A-Type QFN
- KOSRECSYS B-Type QFN
- Other Companies


Applications
- GaN,LDMOS Device
- 5G mmWave, 6G