Liquid Cold Plate, Cooling Block
- Advanced diffusion bonding and brazing technology with exceptional hermeticity.
- Cooling structure design to meet a variety of requirements.
- Efficient liquid flow path design optimized for cooling performance.
- Enhancing reliability by reducing heat dissipation issues through liquid cooling.
- Maintaining the module at an optimal temperature to prevent overheating and ensure stable performance.
Applications
- Power Semiconductor
- CPU, GPU
- Laser cutting M/C, Welding, Marking
- AI, Robot
- Medical Devices
- Various Electronics, etc.
If you have any inquiries about KOSTECSYS
we will respond as quickly as possible.
- +82-32-821-0162
- +82-32-822-4923
- sales@kostec.net
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