KOSTEC is proud to introduce its latest innovations in thermal and electrical performance optimization: Embedded T-Coin / I-Coin and Stepped Copper Coin technologies—designed to meet the increasing demands of next-generation AI, EV, and high-power electronic applications.

As power density continues to rise, conventional PCB and packaging solutions face critical challenges such as thermal via saturation, localized hotspots, CTE mismatch, and high contact resistance. KOSTEC’s embedded coin solutions address these issues by creating a direct vertical thermal path within the PCB stack-up, significantly improving heat dissipation and long-term reliability.

Embedded T-Coin / I-Coin Solution

The Embedded Coin technology enables:

-. Efficient thermal management through direct heat conduction paths

-. Reduced thermo-mechanical stress caused by CTE mismatch

-. Lower contact resistance at high-current interfaces

-. Enhanced reliability under high-power operating conditions

 

With customizable thickness and geometry, high-precision manufacturing (±10 μm tolerance), and compatibility with full copper or hybrid structures (KCMC), the solution supports cost-effective mass production without requiring initial tooling investment.

Stepped Copper Coin for Chip Embedding

 

KOSTEC’s Stepped Copper Coin technology provides an advanced platform for thermal and power delivery optimization, particularly in:

-. EV traction inverters

-. AI server power modules

-. High-density DC-DC converters

-. SiC / GaN-based power systems

 

Key advantages include:

-. 3D Z-axis heat path for rapid hotspot removal

-. Stable and low contact resistance via Au-plated surfaces

-. Tunable thickness for optimized board stack design

-. Scalable supply for high-volume production

 

Additionally, hybrid die-attach zone options (Full Copper, KCMC Hybrid, AMB Hybrid) allow customers to balance thermal performance, stress reduction, and reliability depending on application requirements.

Scalable Platform for Future Electronics

KOSTEC integrates advanced manufacturing technologies—including diffusion bonding, multi-wire cutting, brazing, plating, and tape-and-reel packaging—to deliver a highly scalable and cost-efficient production platform.

These innovations enable customers to achieve up to 60% performance improvement compared to conventional packaging solutions, making them ideal for high-performance and reliability-critical applications.

For more information about KOSTEC’s Embedded Coin and Stepped Copper Coin solutions, please contact us