KOSTECSYS - Low thermal expansion & High heat dissipation & Low parasitic impedance materials.

No.	Item	Materials	Thermal Expansion [ppm/˚C]		Thermal Conductivity[W/(m.K)]25℃ (Z-direction)	Process	Plating
No.	Item	Materials	150˚C	300˚C	Thermal Conductivity[W/(m.K)]25℃ (Z-direction)	Process	Plating
1	Flanges, Carriers	KCMC®12	11.05	9.01	320	Stamping, Wire Cutting, etc.	Ni, NiCo, Ag, PdAu, Au, etc.
		KCMC®20	9.12	7.69	291
		KCMC®28	8.83	7.57	263
		KCMC®33	7.83	6.96	241
		KCMC®40	7.34	6.59	222
		Copper, CuMo, CPC, etc.	-	-	-

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