ENG 
KOR
Spacers, Interposers
Overview
- Spacer is one of key components in DSC power module
- Dual Side Cooling(DSC) on SiC power semiconductor and SiC, IGBT Power module
- Flip chip bonding process available
- Improve reliability performance of power module
- Stamping or wire cutting process into singulation
- Low parasitic inductance packaging of power module
| No. | Item | Materials | Thermal Expansion [ppm/˚C] | Thermal Conductivity[W/(m.K)]25℃ (Z-direction) |
Process | Plating | |
|---|---|---|---|---|---|---|---|
| 150˚C | 300˚C | ||||||
| 1 | Chip Spacer, Interposer | KCMC®12 | 11.05 | 9.01 | 320 | Stamping, Wire Cutting, etc. |
None, Ag, etc. |
| KCMC®20 | 9.12 | 7.69 | 291 | ||||
| KCMC®28 | 8.83 | 7.57 | 263 | ||||
| KCMC®33 | 7.83 | 6.96 | 241 | ||||
| KCMC®40 | 7.34 | 6.59 | 222 | ||||
| CPC141 | 8.20 | 7.94 | 227 | ||||
| 2 | Via Spacer | Copper, CuMo | - | - | - | ||
Applications
- Power Module
- DSC Power Module
- Electric vehicles, Industrial, Renewable energy, Electric chargers, Data centers, etc.
