KOSTECSYS successfully participated in the IMS (International Microwave Symposium) exhibition, a major event in global electronics and communication technologies, held in Washington D.C. in June 2024. The event saw the participation of leading companies from around the world, and KOSTECSYS achieved significant success by showcasing its latest technologies and innovative products.At the IMS exhibition, KOSTECSYS highlighted its leading expertise in electromagnetic waves and wireless communication, attracting significant attention. Notably, its high-frequency package components and MMIC packages, featuring the company's proprietary KCMC low thermal expansion, high thermal conductivity materials, were showcased and garnered interest from many experts and buyers. During the technical meetings held at the event, KOSTECSYS demonstrated its technological capabilities and received positive feedback from the participants.

KOSTECSYS participated in the PCIM (Power Conversion and Intelligent Motion) 2024 exhibition held in Nuremberg, Germany in June 2024, successfully promoting its power semiconductor-related spacer and base plate products, achieving excellent results. PCIM is a global exhibition for power electronics and power conversion technologies, serving as a key event to showcase the latest technologies and trends in the global power semiconductor industry.At this exhibition, KOSTECSYS presented its spacer and base plate products for power semiconductors as key items, which are crucial components for enhancing the performance and stability of power conversion devices. Notably, KOSTECSYS' spacer and base plates, made from KCMC low thermal expansion, high thermal conductivity materials, drew attention as products that can significantly improve the performance and reliability of power semiconductor systems.During the exhibition, KOSTECSYS attracted significant interest through consultations with buyers from various countries. It was particularly evident that there is high demand for power semiconductor solutions in the European and Asian markets. Through this opportunity, KOSTECSYS made great strides in expanding global partnerships and acquiring new customers, while also engaging in strategic discussions for ongoing technological development and product improvement.

KOSTECSYS achieved great success by participating in EuMW (European Microwave Week) 2024, the largest RF exhibition in Europe, in September 2023. This event was a key platform for showcasing global innovations in RF and microwave technology, with numerous industry experts gathering to present the latest technologies and products.KOSTECSYS participated in the exhibition to promote its advanced RF packaging solutions to the global market. During the event, the company engaged in active networking with many global customers. The high level of interest in its high-frequency communication module packages and MMIC packages allowed Costexis to demonstrate its exceptional technological expertise and competitiveness in RF packaging.Throughout the exhibition, KOSTECSYS had the opportunity to establish new partnerships through consultations with various international buyers, while also strengthening relationships with existing customers. Notably, discussions on expanding exports to the European and North American markets were actively held, which is expected to serve as a catalyst for further expanding KOSTECSYS' presence in the global market.

KOSTECSYS successfully participated in the IMS (International Microwave Symposium) exhibition, a major event in global electronics and communication technologies, held in Washington D.C. in June 2024. The event saw the participation of leading companies from around the world, and KOSTECSYS achieved significant success by showcasing its latest technologies and innovative products.At the IMS exhibition, KOSTECSYS highlighted its leading expertise in electromagnetic waves and wireless communication, attracting significant attention. Notably, its high-frequency package components and MMIC packages, featuring the company's proprietary KCMC low thermal expansion, high thermal conductivity materials, were showcased and garnered interest from many experts and buyers. During the technical meetings held at the event, KOSTECSYS demonstrated its technological capabilities and received positive feedback from the participants.

KOSTECSYS participated in the PCIM (Power Conversion and Intelligent Motion) 2024 exhibition held in Nuremberg, Germany in June 2024, successfully promoting its power semiconductor-related spacer and base plate products, achieving excellent results. PCIM is a global exhibition for power electronics and power conversion technologies, serving as a key event to showcase the latest technologies and trends in the global power semiconductor industry.At this exhibition, KOSTECSYS presented its spacer and base plate products for power semiconductors as key items, which are crucial components for enhancing the performance and stability of power conversion devices. Notably, KOSTECSYS' spacer and base plates, made from KCMC low thermal expansion, high thermal conductivity materials, drew attention as products that can significantly improve the performance and reliability of power semiconductor systems.During the exhibition, KOSTECSYS attracted significant interest through consultations with buyers from various countries. It was particularly evident that there is high demand for power semiconductor solutions in the European and Asian markets. Through this opportunity, KOSTECSYS made great strides in expanding global partnerships and acquiring new customers, while also engaging in strategic discussions for ongoing technological development and product improvement.

KOSTECSYS achieved great success by participating in EuMW (European Microwave Week) 2024, the largest RF exhibition in Europe, in September 2023. This event was a key platform for showcasing global innovations in RF and microwave technology, with numerous industry experts gathering to present the latest technologies and products.KOSTECSYS participated in the exhibition to promote its advanced RF packaging solutions to the global market. During the event, the company engaged in active networking with many global customers. The high level of interest in its high-frequency communication module packages and MMIC packages allowed Costexis to demonstrate its exceptional technological expertise and competitiveness in RF packaging.Throughout the exhibition, KOSTECSYS had the opportunity to establish new partnerships through consultations with various international buyers, while also strengthening relationships with existing customers. Notably, discussions on expanding exports to the European and North American markets were actively held, which is expected to serve as a catalyst for further expanding KOSTECSYS' presence in the global market.